Methods and apparatus for fabricating Chip-on-Board modules
An improved method for fabricating Chip-on-Board memory modules using partially-defective memory chips or a combination of partially-defective and flawless memory parts, comprises mounting unpackaged (or a combination of packaged and unpackaged) memory parts to a printed circuit board using one or more selectively settable materials, testing and patching the memory parts, and providing a protective cover after a suitable combination of memory parts and patches produces a fully-functional memory module. Also, a new set of printed circuit boards designed to allow fabrication of memory modules using single-bit patching, any-bit patching, and DDR technology with unpackaged memory parts. In a preferred embodiment, the method and printed circuit boards mentioned above are combined to produce a number of low-cost memory modules using modern, available partially-defective and flawless memory parts.
1. A method of fabricating Chip-on-Board logic modules using selectively settable materials, said method comprising:
mounting unpackaged die using a first layer of selectively-settable material;
hardening a ring of said first layer of selectively-settable material around a periphery said unpackaged die;
covering said first layer of selectively-settable material with a second layer of selectively-settable material; and
capturing bonding wires connecting said unpackaged die to a printed circuit board in said second layer of selectively-settable material.
2. The method of claim 1 , wherein part of said first layer of selectively-settable material extends above said unpackaged die.
3. The method of claim 1 , wherein said capturing bonding wires comprises placing only a part of each of the bonding wires in said second layer of selectively-settable material, ten hardening said second layer of selectively settable material.
4. The method of claim 1 , further comprising placing selectively settable material between said unpackaged die and said printed circuit board to provide a physical and thermal buffer.
5. The method of claim 4 , wherein said selectively settable material between said unpackaged die and said printed circuit board is less cured than said first and second layers of selectively-settable material.
6. The method of claim 1 , wherein said selectively settable materials comprise UV-settable materials.
7. A method of fabricating a Chip-on-Board logic module using selectively settable materials, said method comprising:
mounting one or more electronic logic parts on a printed circuit board using said selectively settable materials;
selectively hardening areas of a selectively settable material;
attaching bonding wires between pads of said logic parts and pads of said printed circuit board;
applying selectively settable material to cover a portion of each of said bonding wires;
then, inspecting bonding wire connections;
readjusting bonding wires, if needed; and
hardening said selectively settable material that covers said bonding wires.
8. The method of claim 7 , wherein said one or more selectively settable materials comprises UV-settable materials.
9. The method of claim 7 , wherein said mounting one or more logic parts further comprises aligning the memory parts on said punted circuit board.
10. The method of claim 7 , wherein said mounting one or logic parts using said selectively settable materials comprises applying a quantity of a selectively settable material between unpackaged logic pans and said printed circuit board.
11. The method of claim 7 , wherein said mounting one or logic parts using said selectively settable materials further comprises applying a quantity of a selectively settable material around unpackaged logic parts.
12. The method of claim 10 , wherein said selectively settable material between unpackaged logic pans and said printed circuit board is not hardened.
13. The method of claim 7 , wherein said selectively hardening areas of said selectively settable material comprises hardening axing of selectively settable material around said unpackaged logic part.
14. The method of claim 7 , wherein one selectively settable material is used.
15. The method of claim 7 , wherein more than one selectively settable materials are used.
16. The method of claim 7 , wherein a selectively settable material used between an unpackaged logic part and a printed circuit board is never hardened, while a selectively settable material used around said unpackaged logic part is hardened.
17. A method of fabricating Chip-on-Board logic modules using selectively settable materials, said method comprising:
mounting unpackaged die on a circuit board using a first layer of selectively-settable material;
hardening a portion of said first layer of selectively-settable material such that said unpackaged die is secured to said circuit board, but some of said selectively-settable material between said unpackaged die and said circuit board is never fully hardened.
18. The method of claim 17 , wherein part of said first layer of selectively-settable material extends above said unpackaged die.
19. The method of claim 17 , further comprising:
applying a second layer of selectively-settable material over said first layer of selectively-settable material; and
hardening said second layer of selectively-settable material so as to capture bonding wires connecting said unpackaged die to a printed circuit board in said hardened second layer of selectively-settable material.
20. The method of claim 19 , wherein said capturing bonding wires comprises placing only a part of each of the bonding wires in said second layer of selectively-settable material, then hardening said second layer of selectively settable material.
21. The method of claim 17 , wherein said selectively-settable material between said unpackaged die and said printed circuit board provides a physical and thermal buffer.
22. The method of claim 17 , wherein said selectively settable material between said unpackaged die and said printed circuit board is in a liquid form.
23. The method of claim 17 , wherein said selectively settable material between said unpackaged die and said printed circuit board is less cured said first layer of selectively-settable material.
24. The method of claim 17 , wherein said selectively settable material comprises a UV-curable material.
25. A Chip-on-Board logic module using selectively settable materials, said module comprising:
a circuit board;
an unpackaged die mounted on said circuit board using a first layer of selectively-settable material, wherein a portion of said first layer of selectively-settable material has been hardened such that said unpackaged die is secured to said circuit board, but some of said selectively-settable material between said unpackaged die and said circuit board is never fully hardened.
26. The module of claim 25 , wherein part of said first layer of selectively-settable material extends above said unpackaged die.
27. The module of claim 25 , further comprising:
a hardened second layer of selectively-settable material applied over said first layer of selectively-settable material; and
a plurality of bonding wires connecting said unpackaged die to said circuit board, wherein said bonding wires are at least partially captured in said hardened second layer of selectively-settable material.
28. The module of claim 25 , wherein said selectively-settable material between said unpackaged die and said printed circuit board provides a physical and thermal buffer.
29. The module of claim 25 , wherein said selectively settable material between said unpackaged die and said printed circuit board is in a liquid form.
30. The module of claim 25 , wherein said selectively settable material between said unpackaged die and said printed circuit board is less cured said first layer of selectively-settable material.
31. The module of claim 25 , wherein said selectively settable material comprises a UV-curable material.
32. The module of claim 25 , wherein said unpackaged die has one or more faulty input/output lines which are compensated for by input/output lines of another unpackaged die mounted on said circuit board.
33. The method of claim 1 , further comprising forming said first layer of selectively-settable material in a ring around said unpackaged die.
34. The method of claim 1 , wherein mounting said unpackaged die further comprises positioning said unpackaged die in said first layer of selectively-settable material in a desired position relative to said printed circuit board before said selectively-settable material is hardened and then performing said hardening of said first layer of selectively-settable material.
35. The method of claim 7 , wherein said logic parts comprise memory parts.
36. The method of claim 1 , wherein said second layer of selectively-settable material is applied in a ring over said first layer of selectively-settable material.
37. The method of claim 1 , wherein said second layer of selectively-settable material captures only a portion of each of said bonding wires.
38. The method of claim 1 , further comprising placing a cover over said unpackaged die and attaching said cover a circuit board on which said unpackaged die is mounted, said cover not being in direct contact with said unpackaged die.
39. The method of claim 1 , further comprising resting said bonding wires on said first layer of selectively-settable material prior to application of said second layer of selectively-settable material.