Patent Assignment
Reel/Frame 031824/0028
Assignment of Assignor's Interest
Recorded: 2013-12-19
Pages: 5
Assignors
LEE, JIN WOO
Executed: 2013-11-25
LEE, HAI JOON
Executed: 2013-11-25
LEE, BYOUNG HWA
Executed: 2013-11-25
JUNG, JIN MAN
Executed: 2013-11-25
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Embedded Multilayer Ceramic Electronic Component and Printed Circuit Board Having the Same