Embedded multilayer ceramic electronic component and printed circuit board having the same
There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0.
1. An embedded multilayer ceramic electronic component comprising:
a ceramic body including a dielectric layer and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other;
a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween; and
first and second external electrodes formed on both end portions of the ceramic body,
wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, the first and second external electrodes are extended to the first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on the first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0, respectively, and
the first and second terminal electrodes are formed of plated copper (Cu).
2. The embedded multilayer ceramic electronic component of claim 1 , wherein when maximum thicknesses of the first and second external electrodes formed on the first and second main surfaces of the ceramic body are defined as tb 1 and tb 2 , respectively, tb 2 /tb 1 satisfy 0.8≦tb 2 /tb 1 ≦1.25.
3. The embedded multilayer ceramic electronic component of claim 1 , wherein when a minimum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tc, tc/tb satisfies 0.8≦tc/tb≦1.0.
4. The embedded multilayer ceramic electronic component of claim 1 , wherein when a thickness of the first and second terminal electrodes is defined as tp, tp satisfies tp≧5 μm.
5. The embedded multilayer ceramic electronic component of claim 1 , wherein when surface roughness of the first and second terminal electrodes is defined as Ra and a thickness of the first and second terminal electrodes is defined as tp, Ra satisfies 200 nm≦Ra≦tp.
6. The embedded multilayer ceramic electronic component of claim 1 , wherein when the thickness of the ceramic body is defined as ts, ts satisfies ts≦100 μm.
7. A printed circuit board having an embedded multilayer ceramic electronic component, the printed circuit board comprising:
an insulating board; and
an embedded multilayer ceramic electronic component including a ceramic body including a dielectric layer embedded in the insulating board and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween; and
first and second external electrodes formed on both end portions of the ceramic body,
wherein the first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode, the second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode, the first and second external electrodes are extended to the first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on the first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0, respectively, and
the first and second terminal electrodes are formed of plated copper (Cu).
8. The printed circuit board of claim 7 , wherein when maximum thicknesses of the first and second external electrodes formed on the first and second main surfaces of the ceramic body are defined as tb 1 and tb 2 , respectively, tb 2 /tb 1 satisfy 0.8≦tb 2 /tb 1 ≦1.25.
9. The printed circuit board of claim 7 , wherein when a minimum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tc, tc/tb satisfies 0.8≦tc/tb≦1.0.
10. The printed circuit board of claim 7 , wherein when a thickness of the first and second terminal electrodes is defined as tp, tp satisfies tp≧5 μm.
11. The printed circuit board of claim 7 , wherein when a surface roughness of the first and second terminal electrodes is defined as Ra and a thickness of the first and second terminal electrodes is defined as tp, Ra satisfies 200 nm≦Ra≦tp.
12. The printed circuit board of claim 7 , wherein when the thickness of the ceramic body is defined as ts, ts satisfies ts≦100 μm.
13. The embedded multilayer ceramic electronic component of claim 1 , wherein the first and second terminal electrodes consist of plated copper (Cu).
14. The printed circuit board of claim 7 , wherein the first and second terminal electrodes consist of plated copper (Cu).