Patent Assignment
Reel/Frame 031849/0886
Assignment of Assignor's Interest
Recorded: 2013-12-26
Pages: 11
Assignors
IWAMOTO, KUNIHIKO
Executed: 2005-06-27
NABATAME, TOSHIHIDE
Executed: 2005-06-27
TOMINAGA, KOJI
Executed: 2005-06-17
YASUDA, TETSUJI
Executed: 2005-06-20
Assignees
ROHM CO., LTD.
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO, 615-8585, JAPAN
RENESAS TECHNOLOGY CORP
4-1M MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-6334, JAPAN
HORIBA, LTD.
2, MIYANOHIGASHI-CHO, KISSHOIN, MINAMI-KU, KYOTO-SHI, KYOTO, 601-8510, JAPAN
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
1-1, HIGASHI 1-CHOME, TSUKUBA-SHI, IBARAKI, 305-8562, JAPAN
Covered Property
(1)
Semiconductor Device, Method of Manufacturing the Same, and Method of Manufacturing Metal Compound Thin Film
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 18, 2009
From: HORIBA, LTD.; RENESAS TECHNOLOGY CORP.
To: ROHM CO., LTD.
Reel/Frame 022842/0014 →
Assignment of Assignor's Interest
Nov 11, 2010
From: HORIBA LTD
To: ROHM CO., LD.
Reel/Frame 025349/0867 →
Assignment of Assignor's Interest
Dec 26, 2013
From: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
To: ROHM CO., LTD.; RENESAS TECHNOLOGY CORP.; HORIBA, LTD.
Reel/Frame 031849/0968 →
Assignment of Assignor's Interest
Dec 26, 2013
From: HORIBA, LTD.
To: ROHM CO., LTD.
Reel/Frame 031850/0050 →
Assignment of Assignor's Interest
Dec 26, 2013
From: RENESAS ELECTRONICS CORPORATION
To: ROHM CO., LTD.
Reel/Frame 031850/0075 →
Change of Name
Dec 26, 2013
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 031869/0917 →