Patent Assignment
Reel/Frame 031876/0893
Assignment of Assignor's Interest
Recorded: 2014-01-02
Pages: 6
Assignors
LEE, CHANGHYUN
Executed: 2013-11-18
SON, BYOUNGKEUN
Executed: 2013-11-18
CHO, HYEJIN
Executed: 2013-11-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Devices