Patent Assignment
Reel/Frame 031889/0856
Assignment of Assignor's Interest
Recorded: 2014-01-03
Pages: 5
Assignors
WANG, JUN-JIE
Executed: 2013-11-04
TSAO, PO-CHAO
Executed: 2013-11-04
WEI, MING-TE
Executed: 2013-11-04
TZOU, SHIH-FANG
Executed: 2013-11-04
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.