Patent Assignment
Reel/Frame 031913/0088
Corrective Assignment to Correct the Replace Original Assignment Statement Document Previously Recorded on Reel 031855 Frame 0559. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2014-01-03
Pages: 9
Assignors
YOON, IN SANG
Executed: 2013-10-01
YANG, DEOKKYUNG
Executed: 2013-09-25
MUN, SEONGHUN
Executed: 2013-09-25
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Interposer Substrate Designs for Semiconductor Packages
Patent:
9,905,491 →
Application:
14/039,938 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 27, 2013
From: YOON, IN SANG; YANG, DEOKKYUNG; MUN, SEONGHUN
To: STATS CHIPPAC LTD.
Reel/Frame 031855/0559 →
Confirmatory License
Jun 6, 2014
From: BROWN UNIVERSITY
To: ENERGY, UNITED STATES DEPARTMENT OF
Reel/Frame 033153/0298 →
Confirmatory License
Jul 10, 2014
From: BROWN UNIVERSITY
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 033297/0043 →
Change of Name
Jul 22, 2016
From: STATS CHIPPAC LTD.
To: STATS CHIPPAC PTE. LTD.
Reel/Frame 039439/0430 →
Assignment of Assignor's Interest
Sep 3, 2025
From: STATS CHIPPAC PTE. LTD.
To: STATS CHIPPAC MANAGEMENT PTE. LTD.
Reel/Frame 072788/0917 →