Patent Assignment
Reel/Frame 031921/0558
Assignment of Assignor's Interest
Recorded: 2014-01-08
Pages: 4
Assignors
LEI, WEI-SHENG
Executed: 2013-12-16
EATON, BRAD
Executed: 2013-12-16
IYER, APARNA
Executed: 2013-12-13
YALAMANCHILI, MADHAVA RAO
Executed: 2013-12-13
KUMAR, AJAY
Executed: 2013-12-13
PARK, JUNGRAE
Executed: 2013-12-11
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Wafer Dicing Method for Improving Die Packaging Quality