Patent Assignment
Reel/Frame 031934/0294
Assignment of Assignor's Interest
Recorded: 2014-01-10
Pages: 2
Assignor
AOI, NOBUO
Executed: 2008-09-11
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Method for Forming Inlaid Interconnect
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jan 10, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 031961/0079 →
Assignment of Assignor's Interest
May 5, 2014
From: PANASONIC CORPORATION (FORMERLY KNOWN AS MATSUSHITA ELECTRIC INDUSTRIAL, CO., LTD.)
To: RPX CORPORATION
Reel/Frame 032826/0585 →
Security Agreement
Mar 9, 2016
From: RPX CORPORATION; RPX CLEARINGHOUSE LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038041/0001 →
Release (Reel 038041 / Frame 0001)
Jan 2, 2018
From: JPMORGAN CHASE BANK, N.A.
To: RPX CORPORATION; RPX CLEARINGHOUSE LLC
Reel/Frame 044970/0030 →
Security Interest
Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
Release of Lien on Patents
Oct 21, 2019
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: RPX CORPORATION
Reel/Frame 050777/0983 →
Release of Security Interest
Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →