IP Library › Assignment 031977/0333
Patent Assignment
Reel/Frame 031977/0333

Assignment of Assignor's Interest

Recorded: 2014-01-15 Pages: 3
Assignor
KURIMURA, HIROYUKI
Executed: 2013-11-29
Assignee
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, 103-8338, JAPAN
Covered Property (1)
Method of Manufacturing Translucent Rigid Substrate Laminate and Translucent Rigid Substrate Bonding Apparatus
Patent: 9,381,727 →
Application: 14/233,069 →
Publication: US 2014/0158280
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 23, 2016
From: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
To: DENKA COMPANY LIMITED
Reel/Frame 038788/0473 →