IP Library › Assignment 038788/0473
Patent Assignment
Reel/Frame 038788/0473

Change of Name

Recorded: 2016-05-23 Pages: 13
Assignor
Assignee
DENKA COMPANY LIMITED
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, JAPAN
Covered Property (1)
Method of Manufacturing Translucent Rigid Substrate Laminate and Translucent Rigid Substrate Bonding Apparatus
Patent: 9,381,727 →
Application: 14/233,069 →
Publication: US 2014/0158280
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 15, 2014
From: KURIMURA, HIROYUKI
To: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
Reel/Frame 031977/0333 →