Assignment of Assignor's Interest

Recorded: 2014-01-23 Pages: 2

Assignors

SONG, KENG YEW

Executed: 2014-01-20

LEE, WAI WAH

Executed: 2014-01-20

WANG, YI BIN

Executed: 2014-01-20

Assignee

ASM TECHNOLOGY SINGAPORE PTE LTD

2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE

Covered Property (1)

Wire Bonder and Method of Calibrating a Wire Bonder

Patent: 9,620,477 →

Application: 14/162,336 →

Publication: US 2014/0209663

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.