Patent Assignment
Reel/Frame 032039/0038
Assignment of Assignor's Interest
Recorded: 2014-01-24
Pages: 3
Assignors
KO, YOUN JO
Executed: 2014-01-23
KI, HYE SU
Executed: 2014-01-23
KIM, IE JU
Executed: 2014-01-23
Assignee
CHEIL INDUSTRIES, INC.
290 GONGDAN-DONG,, GUMI-SI, KYEONGSANGBUK-DO, 730-030, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Connected by Anisotropic Conductive Film Having a Reliability Adhesive Strength
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 7, 2019
From: SAMSUNG SDI CO., LTD.
To: KUDKO CHEMICAL CO., LTD.
Reel/Frame 050640/0740 →
Merger and Change of Name
Oct 7, 2019
From: CHEIL INDUSTRIES INC.; SAMSUNG SDI CO., LTD.; SAMSUNG SDI CO., LTD.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 050646/0718 →
Assignment of Assignor's Interest
Aug 30, 2022
From: KUKDO CHEMICAL CO., LTD.
To: KUKDO ADVANCED MATERIALS CO., LTD.
Reel/Frame 060940/0414 →