IP Library Assignment 032131/0461
Patent Assignment
Reel/Frame 032131/0461

Assignment of Assignor's Interest

Recorded: 2014-02-04 Pages: 8
Assignors
KWON, JI-YUN
Executed: 2014-01-20
LEE, JONG-HWA
Executed: 2014-01-20
CHO, HYUN-YONG
Executed: 2014-01-20
KIM, DAE-YUN
Executed: 2014-01-20
KIM, SANG-KYEON
Executed: 2014-01-20
KIM, SANG-KYUN
Executed: 2014-01-20
KIM, SANG-SOO
Executed: 2014-01-20
YOON, EUN-KYUNG
Executed: 2014-01-20
LEE, JUN-HO
Executed: 2014-01-20
LEE, JIN-YOUNG
Executed: 2014-01-20
CHEON, HWAN-SUNG
Executed: 2014-01-20
HONG, CHUNG-BEOM
Executed: 2014-01-20
HWANG, EUN-HA
Executed: 2014-01-20
Assignee
CHEIL INDUSTRIES INC.
58 GUMI-DAERO, GUMI-SI, GYEONGSANGBUK-DO, GUMI-SI, 730-710, KOREA, REPUBLIC OF
Covered Property (1)
Positive Photosensitive Resin Composition
Patent: 9,256,118 →
Application: 14/236,971 →
Publication: US 2014/0170562
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Aug 31, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039598/0905 →