Patent Assignment
Reel/Frame 039598/0905
Merger
Recorded: 2016-08-31
Pages: 16
Assignor
CHEIL INDUSTRIES INC.
Executed: 2014-07-02
Assignee
SAMSUNG SDI CO., LTD.
150-20, GONGSE, GIHEUNG-GU, YONGIN-SI, GYEONGGI-DO, YONGIN-SI, 17084, KOREA, REPUBLIC OF
Covered Properties
(3)
Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film
Positive Photosensitive Resin Composition
Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device
Application:
14/284,887 →
Publication:
US 2015/0118622
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 23, 2011
From: LEE, JONG-HWA; CHO, HYUN-YONG; IM, MI-RA; CHEON, HWAN-SUNG
To: CHEIL INDUSTRIES INC.
Reel/Frame 027273/0344 →
Assignment of Assignor's Interest
Feb 4, 2014
From: KWON, JI-YUN; LEE, JONG-HWA; CHO, HYUN-YONG; KIM, DAE-YUN
To: CHEIL INDUSTRIES INC.
Reel/Frame 032131/0461 →
Assignment of Assignor's Interest
May 22, 2014
From: KANG, JIN-HEE; KWON, JI-YUN; KIM, DAE-YUN; KIM, SANG-KYEON
To: CHEIL INDUSTRIES INC.
Reel/Frame 032950/0257 →