IP Library Patent Application 14284887
Patent Application
App. No. 14/284,887

Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Display Device

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
14/284,887
Abstract

Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor having a polydispersity of about 1 to about 1.6; (B) a photosensitive diazoquinone compound; (C) a thermal acid generator; and (D) a solvent, a photosensitive resin film using the same, and a display device.

Claims (18)

1 . A positive photosensitive resin composition, comprising:

(A) a polybenzoxazole precursor having a polydispersity of about 1 to about 1.6;

(B) a photosensitive diazoquinone compound;

(C) a thermal acid generator; and

(D) a solvent.

2 . The photosensitive resin composition of claim 1 , wherein the polybenzoxazole precursor has a weight average molecular weight (Mw) of about 3,000 g/mol to about 30,000 g/mol.

3 . The photosensitive resin composition of claim 1 , wherein the polybenzoxazole precursor comprises a repeating unit represented by the following Chemical Formula 1:

wherein, in the above Chemical Formula 1,

each X 1 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, and

each Y 1 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted divalent to hexavalent C1 to C30 aliphatic organic group, or a substituted or unsubstituted divalent to hexavalent C3 to C30 alicyclic organic group.

4 . The photosensitive resin composition of claim 1 , wherein the positive photosensitive resin composition comprises:

about 5 parts by weight to about 100 parts by weight of the photosensitive diazoquinone compound (B);

about 1 part by weight to about 50 parts by weight of the thermal acid generator (C); and

about 100 parts by weight to about 400 parts by weight of the solvent (D)

each based on about 100 parts by weight of the polybenzoxazole precursor (A).

5 . The photosensitive resin composition of claim 1 , wherein the positive photosensitive resin composition further comprises an additive including a silane compound, a surfactant, a leveling agent, or a combination thereof.

6 . A photosensitive resin film prepared using the positive photosensitive resin composition of claim 1 .

7 . A display device including the photosensitive resin film of claim 6 .

Assignments (2)
MERGER Recorded Aug 31, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039598/0905 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2014
From: KANG, JIN-HEE; KWON, JI-YUN; KIM, DAE-YUN; KIM, SANG-KYEON; KIM, SANG-SOO; KIM, YONG-TAE; NOH, KUN-BAE; PARK, EUN-BI; BAEK, JAE-YEOL; SONG, JAE-HWAN; LEE, BUM-JIN; LEE, JONG-HWA; LEE, JIN-YOUNG; HONG, CHUNG-BEUM; HWANG, EUN-HA; HWANG, IN-CHUL
To: CHEIL INDUSTRIES INC.
Reel/Frame 032950/0257 →