Patent Assignment
Reel/Frame 032192/0904
Assignment of Assignor's Interest
Recorded: 2014-02-11
Pages: 7
Assignors
HAN, JUN-WON
Executed: 2014-02-04
KIM, JAE-HYUN
Executed: 2014-02-07
KIM, TAE-HOON
Executed: 2014-02-05
LEE, HO-GEUN
Executed: 2014-02-04
JEONG, YOU-JEONG
Executed: 2014-02-05
CHOI, JUNG-SIK
Executed: 2014-02-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
120, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Supporting Structure, Intermediate Structure of a Semiconductor Package Including the Wafer Supporting Structure