Patent Assignment
Reel/Frame 032214/0949
Assignment of Assignor's Interest
Recorded: 2014-02-13
Pages: 3
Assignors
CHEN, HSIEN-WEI
Executed: 2014-02-10
CHEN, YING-JU
Executed: 2014-02-10
CHIU, MING-YEN
Executed: 2014-02-10
YEH, DER-CHYANG
Executed: 2014-02-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Package Including an Embedded Surface Mount Device and Method of Forming the Same