Patent Assignment
Reel/Frame 032260/0896
Assignment of Assignor's Interest
Recorded: 2014-02-20
Pages: 4
Assignor
DETALLE, MIKAEL
Executed: 2014-01-08
Assignee
IMEC
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for Producing Microbumps on a Semiconductor Component