Patent Assignment
Reel/Frame 032262/0021
Assignment of Assignor's Interest
Recorded: 2014-02-21
Pages: 5
Assignor
HU, DYI-CHUNG
Executed: 2014-02-20
Assignee
UNIMICRON TECHNOLOGY CORPORATION
NO. 38, HSING PONG ROAD, KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property
(1)
Package Stack Device and Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.