Package stack device and fabrication method thereof
A package stack device includes a first package structure having a plurality of first metal posts and a first electronic element disposed on a surface thereof, a second package structure having a plurality of second metal posts and a second electronic element disposed on opposite surfaces thereof, and an encapsulant formed between the first and second package structures for encapsulating the first electronic element. By connecting the first and second metal posts, the second package structure is stacked on the first package structure with the support of the metal posts and the encapsulant filling the gap therebetween so as to prevent warpage of the substrate.
1. A package stack device, comprising:
a first package structure, comprising:
a first substrate having a first surface with a plurality of first metal posts and a second surface opposite to the first surface, and
a first electronic element disposed on the first surface of the first substrate and electrically connected to the first substrate;
a second package structure, comprising:
a second substrate having a third surface and a fourth surface opposite to the third surface, the fourth surface having a plurality of second metal posts connected to the first metal posts, respectively, so as to allow the second package structure to be stacked on the first package structure, and
a second electronic element disposed on the third surface of the second substrate and electrically connected to the second substrate; and
an encapsulant fully formed between the first surface of the first substrate and the fourth surface of the second substrate for encapsulating the first electronic element.
2. The device of claim 1 , wherein the first metal posts are copper posts, respectively.
3. The device of claim 1 , wherein the second metal posts are copper posts, respectively.
4. The device of claim 1 , wherein end surfaces of the first metal posts are in width greater than, equal to or less than end surfaces of the second metal posts.
5. The device of claim 1 , wherein a solder material is filled between the first metal posts and the corresponding second metal posts.
6. The device of claim 1 , wherein the second surface of the first substrate has a plurality of ball pads for solder balls to be mounted thereon.
7. The device of claim 1 , wherein the first electronic element is an active component and/or a passive component.
8. The device of claim 1 , wherein the second electronic element is an active component and/or a passive component.