Patent Assignment
Reel/Frame 032262/0128
Assignment of Assignor's Interest
Recorded: 2014-02-21
Pages: 3
Assignors
MATSUURA, MASAHARU
Executed: 2013-12-26
OGAWA, NOBUYUKI
Executed: 2013-12-26
FUJITA, HIROAKI
Executed: 2013-12-26
FUKAI, HIROYUKI
Executed: 2013-12-26
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 1006606, JAPAN
Covered Property
(1)
Adhesive Film, Multilayer Printed Wiring Board Using Adhesive Film, and Method for Manufacturing Multilayer Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →