IP Library Assignment 032262/0417
Patent Assignment
Reel/Frame 032262/0417

Assignment of Assignor's Interest

Recorded: 2014-02-21 Pages: 4
Assignors
NGUYEN, MY NHU
Executed: 2009-11-12
LIU, PUWEI
Executed: 2009-11-12
Assignee
HENKEL CORPORATION
ONE HENKEL WAY, ROCKY HILL, CONNECTICUT, 06067
Covered Property (1)
Curable Resin Compositions Useful as Underfill Sealants for Use with Low-K Dielectric-Containing Semiconductor Devices
Patent: 8,698,320 →
Application: 12/632,091 →
Publication: US 2011/0133344
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 7, 2014
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 034184/0396 →
Assignment of Assignor's Interest Feb 26, 2015
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 035100/0776 →