IP Library Assignment 032269/0073
Patent Assignment
Reel/Frame 032269/0073

Assignment of Assignor's Interest

Recorded: 2014-02-21 Pages: 6
Assignors
NAGARKAR, KAUSTUBH RAVINDRA
Executed: 2014-02-04
KEIMEL, CHRISTOPHER FRED
Executed: 2014-02-19
Assignee
GENERAL ELECTRIC COMPANY
1 RIVER ROAD, SCHENECTADY, NEW YORK, 12345
Covered Property (1)
Method of Fabricating a 3D Integrated Electronic Device Structure Including Increased Thermal Dissipation Capabilities
Patent: 8,802,475 →
Application: 14/186,362 →
Publication: US 2014/0170811
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 20, 2025
From: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
To: EDISON INNOVATIONS, LLC
Reel/Frame 071674/0420 →
Change of Name Jun 23, 2025
From: GE INTELLECTUAL PROPERTY LICENSING, LLC
To: DOLBY INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 071692/0511 →
Assignment of Assignor's Interest Jun 23, 2025
From: GENERAL ELECTRIC COMPANY
To: GE INTELLECTUAL PROPERTY LICENSING, LLC
Reel/Frame 071704/0816 →