Patent Assignment
Reel/Frame 032281/0394
Assignment of Assignor's Interest
Recorded: 2014-02-24
Pages: 5
Assignors
WU, HUNG-YI
Executed: 2014-02-07
LAI, CHIEN-MING
Executed: 2014-02-07
CHEN, YI-WEN
Executed: 2014-02-07
Assignee
UNITED MICROELECTRONICS CORP.
NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method of the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.