Patent Assignment
Reel/Frame 071913/0125
Assignment of Assignor's Interest
Recorded: 2025-08-01
Pages: 7
Assignor
UNITED MICROELECTRONICS CORP.
Executed: 2025-06-30
Assignee
STELLAR SEMICONDUCTOR JAPAN GK
NISHI-SHINJUKU TAKAGI BUILDING, I-20-3 NISHI-SHINJUKU, SHINJUKU-KU, TOKYO, 160-0023, JAPAN
Covered Properties
(43)
Manufacturing Method of Semiconductor Device
Gate Structures of Cmos Device and Method for Manufacturing the Same
Semiconductor Device
Metal Oxide Semiconductor Transistor and Manufacturing Method Thereof
Semiconductor Device with Ultra Thin Silicide Layer
Field Effect Transistor and Manufacturing Method Thereof
Semiconductor Structure Having Contact Plug and Method of Making the Same
Semiconductor Device and Fabrication Method Thereof
Semiconductor Structure and Manufacturing Method of the Same
Method for Fabricating Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Semiconductor Device Having Contact Plug in Two Dielectric Layers and Two Etch Stop Layers
Metal Oxide Semiconductor Transistor and Manufacturing Method Thereof
Semiconductor Device
Patent:
9,397,214 →
Application:
14/622,943 →
Field Effect Transistor and Manufacturing Method Thereof
Method for Fabricating Semiconductor Device with Paterned Hard Mask
Semiconductor Structure Having Contact Plug and Method of Making the Same
Static Random Access Memory
Semiconductor Device and Method for Fabricating the Same
Patent:
9,455,227 →
Application:
14/935,456 →
Manufacturing Method of Metal Oxide Semiconductor Transistor
Semiconductor Device and Method for Fabricating the Same
Patent:
9,496,396 →
Application:
14/961,902 →
Method of Making Semiconductor Structure Having Contact Plug
Semiconductor Device Having a Cap Layer with V-Shape
Semiconductor Device and Manufacturing Method Thereof
Method for Fabricating Semiconductor Device
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device
Semiconductor Device and Manufacturing Method Thereof
Patent:
9,899,267 →
Application:
15/390,527 →
Semiconductor Device and Manufacturing Method Thereof
Method for Fabricating Cap Layer on an Epitaxial Layer
Semiconductor Device and Manufacturing Method Thereof
Semiconductor Device and Method for Fabricating the Same
Manufacturing Method of Semiconductor Device
Semiconductor Device
Semiconductor Device
Semiconductor Device
Patent:
10,903,143 →
Application:
16/572,627 →
Semiconductor Device and Method for Fabricating the Same
Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Semiconductor Device
Semiconductor Device and Method for Fabricating the Same
Semiconductor Device and Method for Fabricating the Same
Semiconductor Device and Method for Fabricating the Same
Application:
18/888,191 →
Publication:
US 2025/0015158
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 27, 2009
From: LIN, CHUN-HSIEN; HSIEH, CHAO-CHING
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 023013/0098 →
Assignment of Assignor's Interest
Sep 11, 2009
From: LIN, CHUN-HSIEN; LIN, CHIN-FU
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 023216/0226 →
Assignment of Assignor's Interest
Feb 22, 2011
From: LIN, CHUN-HSIEN; HSIEH, CHAO-CHING
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 025822/0322 →
Assignment of Assignor's Interest
Nov 9, 2011
From: CHIANG, WEN-TAI; LIN, CHUN-HSIEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 027195/0484 →
Assignment of Assignor's Interest
Apr 26, 2012
From: LAI, KUO-CHIH; HSU, CHIA CHANG; HO, NIEN-TING; LIAO, BOR-SHYANG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 028108/0275 →
Assignment of Assignor's Interest
Jun 14, 2012
From: CHEN, TONG-YU; WANG, CHIH-JUNG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 028373/0632 →
Assignment of Assignor's Interest
Dec 5, 2012
From: HUNG, CHING-WEN; HUANG, CHIH-SEN; TSAO, PO-CHAO; CHEN, CHIEH-TE
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 029404/0677 →
Assignment of Assignor's Interest
Jun 6, 2013
From: HUNG, CHING-WEN; HUANG, CHIH-SEN; TSAO, PO-CHAO; TZOU, SHIH-FANG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 030563/0589 →
Assignment of Assignor's Interest
Feb 24, 2014
From: WU, HUNG-YI; LAI, CHIEN-MING; CHEN, YI-WEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 032281/0394 →
Assignment of Assignor's Interest
May 15, 2014
From: LAI, KUO-CHIH; HSU, CHIA CHANG; HO, NIEN-TING; LIAO, BOR-SHYANG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 032891/0658 →
Assignment of Assignor's Interest
Sep 17, 2014
From: TUNG, YU-CHENG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 033762/0713 →
Assignment of Assignor's Interest
Nov 10, 2014
From: HUNG, CHING-WEN; HUANG, CHIH-SEN; CHEN, YI-WEI; LIN, CHIEN-TING
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 034132/0124 →
Assignment of Assignor's Interest
Jan 8, 2015
From: CHIANG, WEN-TAI; LIN, CHUN-HSIEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 034668/0973 →
Assignment of Assignor's Interest
Feb 16, 2015
From: CHAN, TIEN-CHEN; WU, HSIN-CHANG; CHEN, CHUN-YU; CHANG, MING-HUA
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 034965/0297 →
Assignment of Assignor's Interest
Mar 3, 2015
From: CHEN, TONG-YU; WANG, CHIH-JUNG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 035074/0004 →
Assignment of Assignor's Interest
Mar 5, 2015
From: HUNG, CHING-WEN; HUANG, CHIH-SEN; TSAO, PO-CHAO; TZOU, SHIH-FANG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 035089/0458 →
Assignment of Assignor's Interest
Apr 28, 2015
From: HUNG, CHING-WEN; HUANG, CHIH-SEN; TSAO, PO-CHAO; CHEN, CHIEH-TE
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 035506/0440 →
Assignment of Assignor's Interest
Jul 28, 2026
From: STELLAR SEMICONDUCTOR JAPAN GK
To: STELLAR SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 075432/0270 →