Field effect transistor and manufacturing method thereof
A field effect transistor (FET) and a manufacturing method thereof are provided. The FET includes a substrate, a fin bump, an insulating layer, a charge trapping structure and a gate structure. The fin bump is disposed on the substrate. The insulating layer is disposed on the substrate and located at two sides of the fin bump. The charge trapping structure is disposed on the insulating layer and located at at least one side of the fin bump. A cross-section of the charge trapping structure is L-shaped. The gate structure covers the fin bump and the charge trapping structure.
1. A field effect transistor, comprising:
a substrate;
a fin bump disposed on the substrate;
an insulating layer disposed on the substrate and located at two sides of the fin bump;
a charge trapping structure disposed on the insulating layer and located at least one side of the fin bump, wherein a cross-section of the charge trapping structure is L-shaped, and the charge trapping structure covers part of the lateral wall of the fin bump; and
a gate structure covering the fin bump and the charge trapping structure;
wherein a top of the charge trapping structure is lower than a top of the fin bump and higher than a bottom of the fin bump.
2. The field effect transistor according to claim 1 , wherein the charge trapping structure is located at two sides of the fin bump.
3. The field effect transistor according to claim 1 , wherein the gate structure and the insulating layer are separated by the charge trapping structure.
4. The field effect transistor according to claim 1 , wherein the thickness of the charge trapping structure is substantially uniform.
5. The field effect transistor according to claim 1 , further comprising:
a high K dielectric layer covering the fin bump and the charge trapping structure.
6. The field effect transistor according to claim 5 , wherein the high K dielectric layer further covers an external lateral wall of the gate structure.
7. The field effect transistor according to claim 1 , wherein the charge trapping structure includes:
a first oxide layer;
a second oxide layer; and
a nitride layer disposed between the first oxide layer and the second oxide layer.
8. The field effect transistor according to claim 1 , wherein the charge trapping structure exposes a top of the fin bump.
9. The field effect transistor according to claim 1 , wherein a height of the fin bump is larger than a height of the charge trapping structure.
10. The field effect transistor according to claim 1 , wherein the charge trapping structure exposes a part of the insulating layer.