IP Library Granted Patent US 9,847,393
Granted Patent B2
US 9,847,393 · App. 15/286,541 · Granted Dec 19, 2017

Semiconductor device

Inventors: Yu-Ming Hsu (Changhua County, TW); Chun-Liang Kuo (Kaohsiung, TW); Tsang-Hsuan Wang (Kaohsiung, TW); Sheng-Hsu Liu (Changhua County, TW); Chieh-Lung Wu (Kaohsiung, TW); Chung-Min Tsai (Tainan, TW); Yi-Wei Chen (Taichung, TW)
Assignee: UNITED MICROELECTRONICS CORP.
H01L29/24H01L29/165H01L29/66636H01L29/66795H01L29/7848
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,847,393
App. No.
15/286,541
Granted
Dec 19, 2017
Kind
B2
Abstract

A semiconductor device is disclosed. The semiconductor device includes: a substrate, a gate structure on the substrate, a spacer adjacent to the gate structure, an epitaxial layer in the substrate adjacent to two sides of the spacer, and a dislocation embedded within the epitaxial layer. Preferably, the top surface of the epitaxial layer is lower than the top surface of the substrate, and the top surface of the epitaxial layer has a V-shape.

Claims (7)

1. A semiconductor device, comprising:

a substrate;

a gate structure on the substrate;

an epitaxial layer adjacent to the gate structure, wherein a top surface of the epitaxial layer comprises a V-shape having a first side extending along a first direction and a second side extending along a second direction; and

a first dislocation and a second dislocation embedded completely within the epitaxial layer, wherein the first dislocation is extending along the first direction and the second dislocation is extending along the second direction.

2. The semiconductor device of claim 1 , wherein the top surface of the epitaxial layer is lower than the top surface of the substrate.

3. The semiconductor device of claim 1 , wherein the epitaxial layer comprises SiP.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2025
From: UNITED MICROELECTRONICS CORP.
To: STELLAR SEMICONDUCTOR JAPAN GK
Reel/Frame 071913/0125 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2016
From: HSU, YU-MING; KUO, CHUN-LIANG; WANG, TSANG-HSUAN; LIU, SHENG-HSU; WU, CHIEH-LUNG; TSAI, CHUNG-MIN; CHEN, YI-WEI
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 039949/0971 →
Priority Claims (1)
TW 104136928 A · Nov 10, 2015 · national
Continuity (2)
Continuation 14961902 · Dec 8, 2015
Related Publication 20170133470A1 · May 11, 2017