Assignment of Assignor's Interest

Recorded: 2014-02-26 Pages: 6

Assignors

OGAWA, ARITO

Executed: 2014-02-19

TAKEDA, TSUYOSHI

Executed: 2014-02-19

Assignee

HITACHI KOKUSAI ELECTRIC INC.

14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN

Covered Property (1)

Method of Manufacturing Semiconductor Device, Method of Processing Substrate, Substrate Processing Apparatus and Computer-Readable Recording Medium

Patent: 9,012,323 →

Application: 14/190,574 →

Publication: US 2014/0179086

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.