Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus and computer-readable recording medium
A method of manufacturing a semiconductor device, includes: alternately performing (i) a first step of alternately supplying a first raw material containing a first metal element and a halogen element and a second raw material containing a second metal element and carbon to a substrate by a first predetermined number of times, and (ii) a second step of supplying a nitridation raw material to the substrate, by a second predetermined number of times, wherein alternating the first and second steps forms a metal carbonitride film containing the first metal element having a predetermined thickness on the substrate.
1. A method of manufacturing a semiconductor device, comprising:
alternately performing a first step of supplying a first raw material containing a first transition metal element and a halogen element to a substrate and a second step of supplying a second raw material containing a second transition metal element and carbon to the substrate by one or more times, thereby forming a metal carbide film containing the first transition metal element on the substrate,
wherein the halogen element contained in the first raw material and the second transition metal element contained in the second raw material are transformed into a gaseous material and discharged to thereby bond the first transition metal element contained in the first raw material and the carbon contained in the second raw material, in forming the metal carbide film.
2. The method of claim 1 , wherein the first transition metal element includes at least one element selected from a group consisting of titanium, tantalum, hafnium, zirconium, molybdenum and tungsten.
3. The method of claim 1 , wherein the second transition metal element includes at least one element selected from a group consisting of titanium, tantalum, hafnium, zirconium, molybdenum and tungsten.
4. The method of claim 1 , wherein the second raw material contains a methyl group.
5. The method of claim 1 , wherein the second raw material contains a cyclopentadienyl group.
6. The method of claim 1 , wherein the second raw material contains a methyl group and a cyclopentadienyl group.
7. The method of claim 1 , wherein the second raw material contains an ethyl group.
8. The method of claim 1 , wherein the metal carbide film containing the first transition metal element is formed on the substrate while discharging the halogen element contained in the first raw material and the second transition metal element contained in the second raw material, as a form of gas.
9. The method of claim 1 , wherein the halogen element contained in the first raw material and the second transition metal element contained in the second raw material are transformed into at least one selected from the group consisting of a gaseous material containing the halogen element, a gaseous material containing the second transition metal element, and a gaseous material containing the halogen element and the second transition metal element and discharged, in forming the metal carbide film.
10. The method of claim 1 , wherein the halogen element contained in the first raw material and the second transition metal element contained in the second raw material produce at least one selected from the group consisting of a gaseous material containing the halogen element, a gaseous material containing the second transition metal element, and a gaseous material containing the halogen element and the second transition metal element and then are discharged as a form of gas, in forming the metal carbide film.
11. The method of claim 1 , wherein the first step of supplying the first raw material and the second step of supplying the second raw material are alternately repeated by a plurality of times, in forming the metal carbide film.
12. A method of processing a substrate, comprising:
alternately performing a first step of supplying a first raw material containing a first transition metal element and a halogen element to a substrate and a second step of supplying a second raw material containing a second transition metal element and carbon to the substrate by one or more times, thereby forming a metal carbide film containing the first transition metal element on the substrate,
wherein the halogen element contained in the first raw material and the second transition metal element contained in the second raw material are transformed into a gaseous material and discharged to thereby bond the first transition metal element contained in the first raw material and the carbon contained in the second raw material, in forming the metal carbide film.
13. A substrate processing apparatus comprising:
a process chamber configured to accommodate a substrate;
a first raw material supply system configured to supply a first raw material containing a first transition metal element and a halogen element to the substrate in the process chamber;
a second raw material supply system configured to supply a second raw material containing a second transition metal element and carbon to the substrate in the process chamber; and
a control unit configured to control the first raw material supply system and the second raw material supply system so as to alternately perform a first processing of supplying the first raw material to the substrate in the process chamber and a second processing of supplying the second raw material to the substrate in the process chamber by one or more times, thereby forming a metal carbide film containing the first transition metal element on the substrate, wherein the halogen element contained in the first raw material and the second transition metal element contained in the second raw material are transformed into a gaseous material and discharged to thereby bond the first transition metal element contained in the first raw material and the carbon contained in the second raw material.
14. A non-transitory computer-readable recording medium storing a program that causes a computer to perform a process comprising:
alternately performing a first step of supplying a first raw material containing a first transition metal element and a halogen element to a substrate and a second step of supplying a second raw material containing a second transition metal element and carbon to the substrate by one or more times, thereby forming a metal carbide film containing the first transition metal element on the substrate,
wherein the halogen element contained in the first raw material and the second transition metal element contained in the second raw material are transformed into a gaseous material and discharged to thereby bond the first transition metal element contained in the first raw material and the carbon contained in the second raw material, in forming the metal carbide film.
15. The method of claim 1 , wherein the metal carbide film containing the first transition metal does not contain the second transition metal.