IP Library › Assignment 032345/0948
Patent Assignment
Reel/Frame 032345/0948

Assignment of Assignor's Interest

Recorded: 2014-03-04 Pages: 7
Assignors
LIAO, YU-WEN
Executed: 2014-02-27
CHU, WEN-TING
Executed: 2014-02-27
ONG, TONG-CHERN
Executed: 2014-02-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Properties (2)
RRAM RETENTION BY DEPOSITING Ti CAPPING LAYER BEFORE HK HfO
Patent: 9,385,316 →
Application: 14/196,416 →
Publication: US 2015/0194602
RRAM RETENTION BY DEPOSITING Ti CAPPING LAYER BEFORE HK HfO
Application: 61/924,504 →