Patent Application
Provisional
App. No. 61/924,504
· Confirmation No. 2907
RRAM RETENTION BY DEPOSITING Ti CAPPING LAYER BEFORE HK HfO
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd.
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2014-02-04 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2014-01-07 | SPEC |
Specification | 10 | View | |
| 2014-01-07 | CLM |
Claims | 5 | View | |
| 2014-01-07 | ABST |
Abstract | 1 | View | |
| 2014-01-07 | DRW |
Drawings-only black and white line drawings | 8 | View | |
| 2014-01-07 | ADS |
Application Data Sheet | 6 | View | |
| 2014-01-07 | APPENDIX |
Appendix to the specification | 10 | View | |
| 2014-01-07 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2014-01-07 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
Yu-Wen Liao
New Taipei City, TAIWAN
Wen-Ting Chu
Kaohsiung City, TAIWAN
Tong-Chern Ong
Chong-Her City, TAIWAN
Attorneys & Agents of Record
Prosecution
- Customer No.
- 107476
- Docket No.
- TSMCP415US
- Confirmation No.
- 2907
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2014-03-04
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Quick Facts
- App. No.
- 61/924,504
- Filed
- 2014-01-07
External Links