Patent Assignment
Reel/Frame 032346/0609
Assignment of Assignor's Interest
Recorded: 2014-03-04
Pages: 12
Assignors
KARHADE, OMKAR G.
Executed: 2013-09-25
DESHPANDE, NITIN A.
Executed: 2013-12-13
DIAS, RAJENDRA C.
Executed: 2013-09-17
CETEGEN, EDVIN
Executed: 2013-09-25
SKOGLUND, LARS D.
Executed: 2013-12-18
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Underfill Material Flow Control for Reduced Die-to-Die Spacing in Semiconductor Packages
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.