IP Library › Assignment 032362/0178
Patent Assignment
Reel/Frame 032362/0178

Assignment of Assignor's Interest

Recorded: 2012-04-04 Pages: 3
Assignor
KONDO, CHIKARA
Executed: 2012-03-09
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device Including Plural Chips Stacked to Each Other
Patent: 8,693,230 →
Application: 13/436,592 →
Publication: US 2012/0250387
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032897/0001 →
Change of Name Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
Assignment of Assignor's Interest Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046863/0001 →