IP Library › Assignment 032390/0304
Patent Assignment
Reel/Frame 032390/0304

Assignment of Assignor's Interest

Recorded: 2014-03-05 Pages: 5
Assignors
KWAG, JOON HWAN
Executed: 2014-02-19
PARK, JAE SUNG
Executed: 2014-02-19
KIM, SANG HUK
Executed: 2014-02-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Multilayer Ceramic Electronic Part and Board Having the Same Mounted Thereon
Patent: 9,258,893 →
Application: 14/198,172 →
Publication: US 2015/0162132