IP Library › Granted Patent US 9,258,893
Granted Patent B2
US 9,258,893 · App. 14/198,172 · Granted Feb 9, 2016

Multilayer ceramic electronic part and board having the same mounted thereon

Inventors: Joon Hwan Kwag (Suwon-Si, KR); Jae Sung Park (Suwon-Si, KR); Sang Huk Kim (Suwon-Si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H05K1/111H01G4/232H01G4/2325H01G4/30H05K1/181H05K3/3442H05K2201/10015
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Quick Facts
Patent No.
US 9,258,893
App. No.
14/198,172
Granted
Feb 9, 2016
Kind
B2
Abstract

There is provided a multilayer ceramic electronic part including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body; upper and lower cover layers formed on upper and lower portions of the active layer; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first external electrode includes a first base electrode, a first conductive layer formed on the first base electrode at a corner portion of the ceramic body, and the second external electrode includes a second base electrode, a second conductive layer formed on the second base electrode at a corner portion of the ceramic body, the first and second conductive layers being positioned outside the active layer in a thickness direction of the ceramic body.

Claims (27)

1. A multilayer ceramic electronic part comprising:

a ceramic body including dielectric layers;

an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween, to thereby form capacitance;

upper and lower cover layers formed on upper and lower portions of the active layer; and

first and second external electrodes formed on both end portions of the ceramic body,

wherein in a cross section of the ceramic body in a length-thickness direction, the first external electrode includes a first base electrode, a first conductive layer formed on the first base electrode at a corner portion of the ceramic body, and a first terminal electrode formed on the first base electrode and the first conductive layer, and the second external electrode includes a second base electrode, a second conductive layer formed on the second base electrode at a corner portion of the ceramic body, and a second terminal electrode formed on the second base electrode and the second conductive layer, the first and second conductive layers being positioned outside the active layer in a thickness direction of the ceramic body.

2. The multilayer ceramic electronic part of claim 1 , wherein regions of the first and second base electrodes in which the first and second conductive layers are not formed have a tetragonal shape when viewed in a direction of an end surface of the ceramic body.

3. The multilayer ceramic electronic part of claim 1 , wherein the first and second base electrodes contain one or more conductive metals selected from a group consisting of copper (Cu), nickel (Ni), silver (Ag), and sliver-palladium (Ag—Pd), and glass.

4. The multilayer ceramic electronic part of claim 3 , wherein the first and second conductive layers contain a larger amount of a conductive metal and a smaller amount of glass as compared to the first and second base electrodes.

5. The multilayer ceramic electronic part of claim 1 , wherein the first and second conductive layers contain a conductive resin.

6. The multilayer ceramic electronic part of claim 5 , wherein the conductive resin contains one or more conductive metals selected from a group consisting of copper (Cu), nickel (Ni), silver (Ag), and sliver-palladium (Ag—Pd), and an epoxy resin.

7. A multilayer ceramic electronic part comprising:

a ceramic body including dielectric layers;

an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween, to thereby form capacitance;

upper and lower cover layers formed on upper and lower portions of the active layer; and

first and second external electrodes formed on both end portions of the ceramic body,

wherein in a cross section of the ceramic body in a length-thickness direction, the first external electrode includes a first base electrode, a first conductive layer formed on the first base electrode at a corner portion of the ceramic body, and a first terminal electrode formed on the first base electrode and the first conductive layer, and the second external electrode includes a second base electrode, a second conductive layer formed on the second base electrode at a corner portion of the ceramic body, and a second terminal electrode formed on the second base electrode and the second conductive layer, the first and second base electrodes containing a conductive metal and glass, and the first and second conductive layers containing a larger amount of a conductive metal and a smaller amount of glass as compared to those of the first and second base electrodes.

8. The multilayer ceramic electronic part of claim 7 , wherein regions of the first and second base electrodes in which the first and second conductive layers are not formed have a tetragonal shape when viewed in a direction of an end surface of the ceramic body.

9. The multilayer ceramic electronic part of claim 7 , wherein the conductive metal is one or more selected from a group consisting of copper (Cu), nickel (Ni), silver (Ag), and sliver-palladium (Ag—Pd).

10. Aboard having a multilayer ceramic electronic part mounted on the board, the board comprising:

a printed circuit board having first and second electrode pads formed on the printed circuit board; and

the multilayer ceramic electronic part of claim 1 mounted on the printed circuit board.

11. The board of claim 10 , wherein regions of the first and second base electrodes in which the first and second conductive layers are not formed have a tetragonal shape when viewed in a direction of an end surface of the ceramic body.

12. A board having a multilayer ceramic electronic part mounted on the board, the board comprising:

a printed circuit board having first and second electrode pads formed on the printed circuit board; and

the multilayer ceramic electronic part of claim 7 mounted on the printed circuit board.

13. The board of claim 12 , wherein regions of the first and second base electrodes in which the first and second conductive layers are not formed have a tetragonal shape when viewed in a direction of an end surface of the ceramic body.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2014
From: KWAG, JOON HWAN; PARK, JAE SUNG; KIM, SANG HUK
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 032390/0304 →
Priority Claims (1)
KR 10-2013-0150825 · Dec 5, 2013 · national
Continuity (1)
Related Publication 20150162132A1 · Jun 11, 2015