IP Library Assignment 032401/0170
Patent Assignment
Reel/Frame 032401/0170

Assignment of Assignor's Interest

Recorded: 2014-03-11 Pages: 11
Assignors
CHIU, CHIA-PIN
Executed: 2013-08-15
MA, QUIG
Executed: 2013-08-06
SANKMAN, ROBERT L
Executed: 2013-09-13
FISCHER, PAUL B
Executed: 2013-09-09
MORROW, PATRICK
Executed: 2013-10-30
LAMBERT, WILLIAM J
Executed: 2013-09-20
GEALER, CHARLES A
Executed: 2013-09-20
OSBORN, TYLER
Executed: 2013-09-20
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Die Assembly on Thin Dielectric Sheet
Patent: 9,177,831 →
Application: 14/041,722 →
Publication: US 2015/0091182
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →