IP Library › Assignment 032434/0297
Patent Assignment
Reel/Frame 032434/0297

Assignment of Assignor's Interest

Recorded: 2014-03-13 Pages: 3
Assignor
KURIMURA, HIROYUKI
Executed: 2013-11-29
Assignee
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, 103-8338, JAPAN
Covered Property (1)
Method of Manufacturing Translucent Rigid Substrate Laminate and Translucent Rigid Substrate Bonding Apparatus
Patent: 9,358,763 →
Application: 14/233,025 →
Publication: US 2014/0150967
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 15, 2014
From: KURIMURA, HIROYUKI
To: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
Reel/Frame 031976/0053 →
Change of Name Apr 13, 2016
From: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
To: DENKA COMPANY LIMITED
Reel/Frame 038426/0876 →