IP Library › Assignment 038426/0876
Patent Assignment
Reel/Frame 038426/0876

Change of Name

Recorded: 2016-04-13 Pages: 13
Assignor
Assignee
DENKA COMPANY LIMITED
1-1, NIHONBASHI-MUROMACHI 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property (1)
Method of Manufacturing Translucent Rigid Substrate Laminate and Translucent Rigid Substrate Bonding Apparatus
Patent: 9,358,763 →
Application: 14/233,025 →
Publication: US 2014/0150967
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 15, 2014
From: KURIMURA, HIROYUKI
To: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
Reel/Frame 031976/0053 →
Assignment of Assignor's Interest Mar 13, 2014
From: KURIMURA, HIROYUKI
To: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
Reel/Frame 032434/0297 →