IP Library › Assignment 032460/0761
Patent Assignment
Reel/Frame 032460/0761

Assignment of Assignor's Interest

Recorded: 2014-03-18 Pages: 10
Assignors
HU, SHAO-CHUNG
Executed: 2014-03-18
HORNG, KUO-YANG
Executed: 2014-03-18
YANG, LING-YUEH
Executed: 2014-03-18
LIU, WEI-CHING
Executed: 2014-03-18
CHAO, PEN-SHAN
Executed: 2014-03-18
CHEN, KUN-FENG
Executed: 2014-03-18
HSU, LOUIS LU-CHEN
Executed: 2014-03-18
Assignee
CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY ARMAMENTS BUREAU, M.N.D.
NO.481, JIA-AN SECTION JHONGJHENG RD., NEIGHBOR 6,, JIA-AN VILLAGE, LONGTAN TOWNSHIP, TAOYUAN COUNTY 325, TAIWAN
Covered Property (1)
Microelectronic 3D Packaging Structure and Method of Manufacturing the Same
Patent: 9,288,907 →
Application: 14/217,621 →
Publication: US 2015/0271921
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 12, 2016
From: CHUNG-SHAN INSTITUTE OF TECHNOLOGY, ARMAMENTS BUREAU, M.N.D.
To: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 037616/0350 →