IP Library › Assignment 037616/0350
Patent Assignment
Reel/Frame 037616/0350

Change of Name

Recorded: 2016-01-12 Pages: 32
Assignor
Assignee
NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
NO. 481, CHIA AN SEC., CHUNG CHENG RD., LONGTAN DIST., TAOYUAN CITY 325, TAIWAN
Covered Property (1)
Microelectronic 3D Packaging Structure and Method of Manufacturing the Same
Patent: 9,288,907 →
Application: 14/217,621 →
Publication: US 2015/0271921
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 18, 2014
From: HU, SHAO-CHUNG; HORNG, KUO-YANG; YANG, LING-YUEH; LIU, WEI-CHING
To: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY ARMAMENTS BUREAU, M.N.D.
Reel/Frame 032460/0761 →