IP Library › Assignment 032473/0888
Patent Assignment
Reel/Frame 032473/0888

Assignment of Assignor's Interest

Recorded: 2014-03-19 Pages: 5
Assignor
ELPIDA MEMORY, INC.
Executed: 2013-09-30
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Properties (8)
Memory Device with Pin Register to Set Input/Output Direction and Bitwidth of Data Signals.
Patent: 9,030,895 →
Application: 12/510,633 →
Publication: US 2010/0030954
Wiring Configuration of a Bus System and Power Wires in a Memory Chip
Patent: 8,724,360 →
Application: 13/327,057 →
Publication: US 2013/0155752
Method of Manufacturing Semiconductor Device
Patent: 8,748,325 →
Application: 13/782,300 →
Publication: US 2014/0038424
Overheat Protection Circuit and Method in an Accelerated Aging Test of an Integrated Circuit
Application: 14/162,282 →
Publication: US 2015/0204941
Apparatus and Method of Pre-Charge and Equalization Control for Dynamic Random Access Memory
Patent: 9,837,139 →
Application: 14/166,413 →
Publication: US 2014/0211545
Partial Access Mode for Dynamic Random Access Memory
Patent: 9,640,240 →
Application: 14/168,899 →
Publication: US 2015/0149717
Semiconductor Device
Patent: 9,053,779 →
Application: 14/169,442 →
Publication: US 2014/0232438
Apparatuses and Methods for Coupling Semiconductor Devices of a Memory Module in a Memory System
Patent: 9,524,756 →
Application: 14/169,659 →
Publication: US 2014/0233335
Related Assignments (15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 28, 2009
From: MIURA, SEIJI; HARAGUCHI, YOSHINORI; ABE, KAZUHIKO; KANEKO, SHOJI
To: ELPIDA MEMORY, INC.
Reel/Frame 023014/0757 →
Assignment of Assignor's Interest Dec 20, 2011
From: KUZMENKA, MAKSIM; SCHEIDELER, DIRK; SCHILLER, KAI
To: ELPIDA MEMORY, INC.
Reel/Frame 027418/0615 →
Assignment of Assignor's Interest Apr 25, 2013
From: HORIKAWA, MITSUHIRO; ODE, HIROYUKI; HARUKI, MASASHI; TAKISHIMA, SHIGEKI
To: ELPIDA MEMORY, INC.
Reel/Frame 030283/0159 →
Assignment of Assignor's Interest Jan 30, 2014
From: NAGATA, KYOICHI; MOTOYAMA, YUUJI
To: ELPIDA MEMORY, INC.
Reel/Frame 032094/0438 →
Assignment of Assignor's Interest Feb 3, 2014
From: NISHIO, YOJI; YOSHIMURA, TADAAKI; MATSUO, KOJI
To: ELPIDA MEMORY, INC.
Reel/Frame 032117/0302 →
Assignment of Assignor's Interest Mar 19, 2014
From: MIYANO, KAZUTAKA; TAKISHITA, RYUJI; KONNO, TAKESHI
To: ELPIDA MEMORY, INC.
Reel/Frame 032470/0610 →
Assignment of Assignor's Interest May 20, 2014
From: RIHO, YOSHIRO
To: ELPIDA MEMORY, INC.
Reel/Frame 032931/0164 →
Assignment of Assignor's Interest Sep 30, 2014
From: SCHNEIDER, RONNY; BROX, MARTIN; OCON-GARRIDO, JUAN-ANTONIO
To: ELPIDA MEMORY, INC.
Reel/Frame 033848/0885 →
Security Interest May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest. Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Security Interest Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
Release of Security Interest Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →