Patent Assignment
Reel/Frame 032517/0054
Assignment of Assignor's Interest
Recorded: 2014-03-25
Pages: 4
Assignors
KOSUGI, TETSUYA
Executed: 2014-03-18
TAKEWAKI, MOTOYA
Executed: 2014-03-18
MURATA, HITOSHI
Executed: 2014-03-18
UENO, MASAAKI
Executed: 2014-03-18
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Insulation Structure and Method of Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.