Patent Assignment
Reel/Frame 032528/0159
Assignment of Assignor's Interest
Recorded: 2014-03-26
Pages: 3
Assignee
SANDIA CORPORATION
P.O. BOX 5800, MS-0161, LEGAL TECHNOLOGY TRANSFER CENTER, ALBUQUERQUE, NEW MEXICO, 87185
Covered Property
(1)
Method of Forming Through Substrate Vias (Tsvs) and Singulating and Releasing Die Having the Tsvs from a Mechanical Support Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.