Patent Assignment
Reel/Frame 032912/0778
Confirmatory License
Recorded: 2014-05-16
Pages: 2
Assignor
SANDIA CORPORATION
Executed: 2014-03-25
Assignee
U.S. DEPARTMENT OF ENERGY
1000 INDEPENDNCE AVE., SW, WASHINGTON, DISTRICT OF COLUMBIA, 20585
Covered Property
(1)
Method of Forming Through Substrate Vias (Tsvs) and Singulating and Releasing Die Having the Tsvs from a Mechanical Support Substrate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.