Patent Assignment
Reel/Frame 032541/0661
Assignment of Assignor's Interest
Recorded: 2014-03-27
Pages: 3
Assignors
CHI, HEEJO
Executed: 2014-03-26
LEE, HEESOO
Executed: 2014-03-26
KWON, OMIN
Executed: 2014-03-26
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Coreless Substrate and Method of Manufacture Thereof
Patent:
9,673,171 →
Application:
14/226,711 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.