Patent Assignment
Reel/Frame 032559/0850
Assignment of Assignor's Interest
Recorded: 2014-03-31
Pages: 5
Assignors
ARAI, HIDETA
Executed: 2014-03-07
MIKI, ATSUSHI
Executed: 2014-03-10
ARAI, KOHSUKE
Executed: 2014-03-17
NAKAMURO, KAICHIRO
Executed: 2014-03-17
Assignee
JX NIPPON MINING & METALS CORPORATION
6-3, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 1008164, JAPAN
Covered Property
(1)
Surface Treated Copper Foil and Laminate Using the Same, Printed Wiring Board, and Copper Clad Laminate
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.