IP Library Assignment 032637/0588
Patent Assignment
Reel/Frame 032637/0588

Assignment of Assignor's Interest

Recorded: 2014-04-09 Pages: 9
Assignors
NODA, TAKAAKI
Executed: 2014-04-02
SHIMAMOTO, SATOSHI
Executed: 2014-03-27
NOHARA, SHINGO
Executed: 2014-03-31
HIROSE, YOSHIRO
Executed: 2014-03-27
MAEDA, KIYOHIKO
Executed: 2014-04-01
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Patent: 9,793,107 →
Application: 14/227,809 →
Publication: US 2015/0072537
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →