Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

1. A method of manufacturing a semiconductor device, comprising:

forming a thin film containing silicon, oxygen and carbon or a thin film containing silicon, oxygen, carbon and nitrogen on a substrate by performing a cycle two or more times, the cycle including:

forming a first film containing silicon, oxygen and carbon or a first film containing silicon and oxygen by performing a set a predetermined number of times, the set including:

supplying a precursor gas serving as a silicon source and a carbon source or a precursor gas serving as a silicon source but no carbon source, and a first catalyst gas to the substrate; and

supplying an oxidizing gas and a second catalyst gas to the substrate; and

causing reaction of the first film with a modifying gas under a non-plasma atmosphere to modify the first film into a second film further containing carbon, a second film further containing nitrogen, or a second film further containing carbon and nitrogen, the modifying gas containing at least one selected from the group consisting of carbon and nitrogen.

2. The method of claim 1 , wherein the act of supplying the precursor gas and the first catalyst gas and the act of supplying the oxidizing gas and the second catalyst gas are performed under a non-plasma atmosphere.

3. The method of claim 1 , wherein, in the act of supplying the precursor gas and the first catalyst gas and the act of supplying the oxidizing gas and the second catalyst gas, a temperature of the substrate is set to a room temperature to 150 degrees C.

4. The method of claim 1 , wherein the act of forming the first film and the act of modifying the first film are performed under a state where the substrate is accommodated in the same process chamber.

5. The method of claim 1 , wherein the act of forming the first film and the act of modifying the first film are performed under a state where the substrate is accommodated in different process chambers.

6. The method of claim 1 , wherein supplying the precursor gas and the first catalyst gas is performed before supplying the oxidizing gas and the second catalyst gas, and supplying the modifying gas is performed after supplying the oxidizing gas and the second catalyst gas.

7. The method of claim 1 , wherein a temperature of the substrate in the act of supplying the modifying gas is set to be equal to a temperature of the substrate in the act of supplying the precursor gas and the first catalyst gas and the act of supplying the oxidizing gas and the second catalyst gas.

8. The method of claim 1 , wherein, in the act of supplying the modifying gas, a temperature of the substrate is set to a room temperature to 500 degrees C.

9. The method of claim 1 , wherein, in the act of supplying the modifying gas, a temperature of a substrate is set to 200 to 900 degrees C.

10. The method of claim 1 , wherein, in the act of supplying the modifying gas, the modifying gas is supplied to the substrate in a plasma-excited state.

11. The method of claim 1 , wherein the precursor gas contains silicon, carbon and a halogen element and has a Si—C bonding.

12. The method of claim 11 , wherein the precursor gas contains at least one selected from the group consisting of an alkyl group and an alkylene group.

13. The method of claim 11 , wherein the precursor gas has at least one selected from the group consisting of a Si—C—Si bonding and a Si—C—C—Si bonding.

14. The method of claim 1 , wherein the modifying gas includes at least one selected from the group consisting of a carbon-containing gas, a nitrogen-containing gas and a gas containing carbon and nitrogen in one molecule.

15. The method of claim 1 , wherein the modifying gas includes at least one selected from the group consisting of a hydrocarbon-based gas, an amine-based gas and a non-amine-based gas.

16. The method of claim 1 , wherein the first and second catalyst gases include an amine-based catalyst gas.