IP Library › Assignment 032642/0982
Patent Assignment
Reel/Frame 032642/0982

Notice of Change of Address of Assignee

Recorded: 2014-04-09 Pages: 2
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polishing Slurry for Cmp, and Polishing Method
Patent: 8,778,217 →
Application: 12/307,440 →
Publication: US 2009/0209104
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 5, 2009
From: KIMURA, TADAHIRO
To: HITACHI CHEMICAL CO., LTD.
Reel/Frame 022056/0051 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →